Analysis of impedance 3D surface using Rapid RLC solver

Low impedance of the return current path and small loop area of the return current loop are the best practices design criteria to minimize electromagnetic emission from printed circuit board (PCB). In circuit, the high-frequency return current signal will find its way back to the source by flowing along the path of least impedance. In this work Rapid RLC solver is considered for fast and accurate analysis of current return paths on 3D surface. Obtained numerical results are compared with full wave electromagnetic TriD solver.